BUILD-UP MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a build-up multilayer wiring board, exhibiting superior reliability, and in which the occurrence of delamination is unlikely at the surface layer part of a core substrate. SOLUTION: The build-up multilayer wiring board 7 comprises a core substrate, i.e. a low-tempera...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHIO FUMITAKA, KANBE ROKURO, ASANO TOSHIYA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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