BUILD-UP MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a build-up multilayer wiring board, exhibiting superior reliability, and in which the occurrence of delamination is unlikely at the surface layer part of a core substrate. SOLUTION: The build-up multilayer wiring board 7 comprises a core substrate, i.e. a low-temperature firing ceramic substrate 1, a build-up layer 2, and a dummy metallized layer 61 as a metallic reinforcing body. The low-temperature firing ceramic substrate 1 has a chip-mounting surface 18 (first major surface) and a ball grid bonding face 19 (second major surface). The build-up layer 2 has such a structure that conductor layers 41 and 42 and resin insulation layers 21 and 22 are formed in layers alternately, and it is formed on the chip mounting surface 18. The metallized layer 61 is arranged at the outer edge part 10 of the low-temperature firing ceramic substrate 1. COPYRIGHT: (C)2005,JPO&NCIPI