WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a wiring board in which a crack develops in a junction interface section, the corrosion of a conductor layer due to a contact with the outside air is prevented and malfunctions when the board is operated can be avoided, and to provide a manufacturing method for the w...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SASAKI YASUHIRO, YOSHIHARA YASUHIKO, ONITANI MASAMITSU, ARIKAWA HIDEHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board in which a crack develops in a junction interface section, the corrosion of a conductor layer due to a contact with the outside air is prevented and malfunctions when the board is operated can be avoided, and to provide a manufacturing method for the wiring board. SOLUTION: The wiring board 8 has an insulating board, having at least an insulator layer 1 composed of ceramics and the conductor layer 3, having approximately the same thickness as the insulator layer 1. The wiring board 8 is constituted so that a surface boundary on the surface side of the wiring board 8, at a boundary between the insulator layer 1 of the insulating board formed on the outermost layer of the wiring board 8 and the conductor layer 3 is coated with a coating resin layer 7 containing a resin. COPYRIGHT: (C)2005,JPO&NCIPI