METHOD AND DEVICE FOR FORMING WIRING, WIRING BOARD, AND INK SET

PROBLEM TO BE SOLVED: To suppress bleeding in the contact region between conductive and insulating patterns even if simultaneously forming the conductive and insulating patterns on a substrate, and to form a fine circuit pattern. SOLUTION: First liquid contains a first constituent and forms the cond...

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Bibliographische Detailangaben
Hauptverfasser: MORI TAKASHI, TSURUOKA YUJI, TAKAYAMA HIDETO, NISHIWAKI OSAMU, MOTAI HIDEKAZU, IWATA KAZUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To suppress bleeding in the contact region between conductive and insulating patterns even if simultaneously forming the conductive and insulating patterns on a substrate, and to form a fine circuit pattern. SOLUTION: First liquid contains a first constituent and forms the conductive pattern. Second liquid contains a second constituent in which interface coagulation is generated in the contact region by coming into contact with the first constituent and forms the insulating pattern. The first liquid and the second one are supplied to the substrate so that they contact each other, thus forming wiring comprising the insulating pattern and conductive pattern on the substrate. COPYRIGHT: (C)2005,JPO&NCIPI