METHOD FOR JOINING SUBSTRATE AND COMPOSITE SUBSTRATE

METHOD FOR JOINING SUBSTRATE AND COMPOSITE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for joining substrates by which the thickness and weight of a joint is not increased by improving conductivity between terminals, peel strength is high and costs for joining is reduced; and to provide a composite substrate. SOLUTION: The method for joining a...

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Hauptverfasser: IWASAKI SHOJI, OKADA ATSUSHI, PONPANPAANII ANAN, MATSUMOTO RYOKICHI
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator IWASAKI SHOJI
OKADA ATSUSHI
PONPANPAANII ANAN
MATSUMOTO RYOKICHI
description PROBLEM TO BE SOLVED: To provide a method for joining substrates by which the thickness and weight of a joint is not increased by improving conductivity between terminals, peel strength is high and costs for joining is reduced; and to provide a composite substrate. SOLUTION: The method for joining a pair of the substrates 1 and 2 provided with the terminals 12 and 22 joins the joints of the terminals 12 and 22 with ultrasonic waves in the state of superposing the substrates 1 and 2, so as to make the terminals 12 and 22 contact with each other. The composite substrate consists of at least a pair of the substrates 1 and 2 provided with the terminals 12 and 22, and the joints of the terminals 12 and 22 are joined with ultrasonic waves in the state of superposing the substrates 1 and 2 so as to make the terminals 12 and 22 contact with each other. COPYRIGHT: (C)2005,JPO&NCIPI
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD FOR JOINING SUBSTRATE AND COMPOSITE SUBSTRATE
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