METHOD FOR JOINING SUBSTRATE AND COMPOSITE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for joining substrates by which the thickness and weight of a joint is not increased by improving conductivity between terminals, peel strength is high and costs for joining is reduced; and to provide a composite substrate. SOLUTION: The method for joining a...

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Hauptverfasser:	IWASAKI SHOJI, OKADA ATSUSHI, PONPANPAANII ANAN, MATSUMOTO RYOKICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for joining substrates by which the thickness and weight of a joint is not increased by improving conductivity between terminals, peel strength is high and costs for joining is reduced; and to provide a composite substrate. SOLUTION: The method for joining a pair of the substrates 1 and 2 provided with the terminals 12 and 22 joins the joints of the terminals 12 and 22 with ultrasonic waves in the state of superposing the substrates 1 and 2, so as to make the terminals 12 and 22 contact with each other. The composite substrate consists of at least a pair of the substrates 1 and 2 provided with the terminals 12 and 22, and the joints of the terminals 12 and 22 are joined with ultrasonic waves in the state of superposing the substrates 1 and 2 so as to make the terminals 12 and 22 contact with each other. COPYRIGHT: (C)2005,JPO&NCIPI