BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a bonding method and an apparatus for bonding electronic component ensuring excellent bonding quality in regard to the bonding method, apparatus for electronic component, and a circuit board. SOLUTION: In the method and the apparatus for bonding electronic component;...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKAMURA KOICHI, KASHU MASANORI, NISHIMURA TAKAO, TAKASHIMA AKIRA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NAKAMURA KOICHI
KASHU MASANORI
NISHIMURA TAKAO
TAKASHIMA AKIRA
description PROBLEM TO BE SOLVED: To provide a bonding method and an apparatus for bonding electronic component ensuring excellent bonding quality in regard to the bonding method, apparatus for electronic component, and a circuit board. SOLUTION: In the method and the apparatus for bonding electronic component; a circuit board 16 including a plurality of electrode terminals is attracted and held to a bonding stage 14, a semiconductor element 22 having a plurality of projected electrodes is attracted and held to a bonding tool 20, the semiconductor element 22 is pressed with a pressing means 32 in the same direction as the direction of load applied to the semiconductor element 22 at the time of bonding the position approximated to the chip mounting region at the external side of the chip mounting region of the circuit board, and the projected electrode and the electrode terminal are connected by giving the load and ultrasonic wave vibration to the semiconductor element 22 under the condition that the circuit board 16 is surely fixed. COPYRIGHT: (C)2005,JPO&NCIPI
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005183459A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005183459A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005183459A3</originalsourceid><addsrcrecordid>eNrjZDB18vdz8fRzV_B1DfHwd1Fw9APigADHIMeQ0GAFN_8gBVcfV-eQIH8_T2cFZ3_fAH8_V78QHgbWtMSc4lReKM3NoOTmGuLsoZtakB-fWlyQmJyal1oS7xVgZGBgamhhbGJq6WhMlCIANzYoIg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT</title><source>esp@cenet</source><creator>NAKAMURA KOICHI ; KASHU MASANORI ; NISHIMURA TAKAO ; TAKASHIMA AKIRA</creator><creatorcontrib>NAKAMURA KOICHI ; KASHU MASANORI ; NISHIMURA TAKAO ; TAKASHIMA AKIRA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a bonding method and an apparatus for bonding electronic component ensuring excellent bonding quality in regard to the bonding method, apparatus for electronic component, and a circuit board. SOLUTION: In the method and the apparatus for bonding electronic component; a circuit board 16 including a plurality of electrode terminals is attracted and held to a bonding stage 14, a semiconductor element 22 having a plurality of projected electrodes is attracted and held to a bonding tool 20, the semiconductor element 22 is pressed with a pressing means 32 in the same direction as the direction of load applied to the semiconductor element 22 at the time of bonding the position approximated to the chip mounting region at the external side of the chip mounting region of the circuit board, and the projected electrode and the electrode terminal are connected by giving the load and ultrasonic wave vibration to the semiconductor element 22 under the condition that the circuit board 16 is surely fixed. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050707&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005183459A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050707&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005183459A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAMURA KOICHI</creatorcontrib><creatorcontrib>KASHU MASANORI</creatorcontrib><creatorcontrib>NISHIMURA TAKAO</creatorcontrib><creatorcontrib>TAKASHIMA AKIRA</creatorcontrib><title>BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT</title><description>PROBLEM TO BE SOLVED: To provide a bonding method and an apparatus for bonding electronic component ensuring excellent bonding quality in regard to the bonding method, apparatus for electronic component, and a circuit board. SOLUTION: In the method and the apparatus for bonding electronic component; a circuit board 16 including a plurality of electrode terminals is attracted and held to a bonding stage 14, a semiconductor element 22 having a plurality of projected electrodes is attracted and held to a bonding tool 20, the semiconductor element 22 is pressed with a pressing means 32 in the same direction as the direction of load applied to the semiconductor element 22 at the time of bonding the position approximated to the chip mounting region at the external side of the chip mounting region of the circuit board, and the projected electrode and the electrode terminal are connected by giving the load and ultrasonic wave vibration to the semiconductor element 22 under the condition that the circuit board 16 is surely fixed. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB18vdz8fRzV_B1DfHwd1Fw9APigADHIMeQ0GAFN_8gBVcfV-eQIH8_T2cFZ3_fAH8_V78QHgbWtMSc4lReKM3NoOTmGuLsoZtakB-fWlyQmJyal1oS7xVgZGBgamhhbGJq6WhMlCIANzYoIg</recordid><startdate>20050707</startdate><enddate>20050707</enddate><creator>NAKAMURA KOICHI</creator><creator>KASHU MASANORI</creator><creator>NISHIMURA TAKAO</creator><creator>TAKASHIMA AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20050707</creationdate><title>BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT</title><author>NAKAMURA KOICHI ; KASHU MASANORI ; NISHIMURA TAKAO ; TAKASHIMA AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005183459A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAMURA KOICHI</creatorcontrib><creatorcontrib>KASHU MASANORI</creatorcontrib><creatorcontrib>NISHIMURA TAKAO</creatorcontrib><creatorcontrib>TAKASHIMA AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAMURA KOICHI</au><au>KASHU MASANORI</au><au>NISHIMURA TAKAO</au><au>TAKASHIMA AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT</title><date>2005-07-07</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a bonding method and an apparatus for bonding electronic component ensuring excellent bonding quality in regard to the bonding method, apparatus for electronic component, and a circuit board. SOLUTION: In the method and the apparatus for bonding electronic component; a circuit board 16 including a plurality of electrode terminals is attracted and held to a bonding stage 14, a semiconductor element 22 having a plurality of projected electrodes is attracted and held to a bonding tool 20, the semiconductor element 22 is pressed with a pressing means 32 in the same direction as the direction of load applied to the semiconductor element 22 at the time of bonding the position approximated to the chip mounting region at the external side of the chip mounting region of the circuit board, and the projected electrode and the electrode terminal are connected by giving the load and ultrasonic wave vibration to the semiconductor element 22 under the condition that the circuit board 16 is surely fixed. COPYRIGHT: (C)2005,JPO&amp;NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2005183459A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T16%3A50%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKAMURA%20KOICHI&rft.date=2005-07-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005183459A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true