BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a bonding method and an apparatus for bonding electronic component ensuring excellent bonding quality in regard to the bonding method, apparatus for electronic component, and a circuit board. SOLUTION: In the method and the apparatus for bonding electronic component; a circuit board 16 including a plurality of electrode terminals is attracted and held to a bonding stage 14, a semiconductor element 22 having a plurality of projected electrodes is attracted and held to a bonding tool 20, the semiconductor element 22 is pressed with a pressing means 32 in the same direction as the direction of load applied to the semiconductor element 22 at the time of bonding the position approximated to the chip mounting region at the external side of the chip mounting region of the circuit board, and the projected electrode and the electrode terminal are connected by giving the load and ultrasonic wave vibration to the semiconductor element 22 under the condition that the circuit board 16 is surely fixed. COPYRIGHT: (C)2005,JPO&NCIPI