BONDING BODY AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a bonding technique for providing a measure for higher density and reduction in manufacturing cost, ensuring the higher reliability of the electrical continuity of a bonding area, and enabling the more enhanced bonding of a material to be bonded. SOLUTION: The bondin...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NAKAMURA HIDEYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!