BONDING BODY AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a bonding technique for providing a measure for higher density and reduction in manufacturing cost, ensuring the higher reliability of the electrical continuity of a bonding area, and enabling the more enhanced bonding of a material to be bonded. SOLUTION: The bondin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NAKAMURA HIDEYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a bonding technique for providing a measure for higher density and reduction in manufacturing cost, ensuring the higher reliability of the electrical continuity of a bonding area, and enabling the more enhanced bonding of a material to be bonded. SOLUTION: The bonding body 1 is formed by bonding terminals of a pair of bonding materials 10, 20 to be bonded comprising a plurality of terminals 13, 23 on base materials 11, 21. The base material 11 of the bonding material 10 to be bonded is formed with an aperture 51 at an area 61 between the terminals. Moreover, a gap 71 between the terminals connected to the aperture 51 is filled with an insulating sealing material 40. COPYRIGHT: (C)2005,JPO&NCIPI