LINKAGE GUIDED BOND HEAD

PROBLEM TO BE SOLVED: To provide a bond head that can be used irrespective of the size of a device to be bonded by a bonding machine. SOLUTION: This bond head is used for the bonding machine having a frame member. The bond head has an arm assembly, and a linkage coupled between the arm assembly and...

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Bibliographische Detailangaben
1. Verfasser:	SADLER RICHARD D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a bond head that can be used irrespective of the size of a device to be bonded by a bonding machine. SOLUTION: This bond head is used for the bonding machine having a frame member. The bond head has an arm assembly, and a linkage coupled between the arm assembly and the frame member. The linkage forms a virtual pivot point below a lower surface of the arm assembly. COPYRIGHT: (C)2005,JPO&NCIPI