POWDERY MIXTURE FOR BLENDING WITH RESIN, AND RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a powdery mixture for a resin composition having a good fluidity even in the case of having a large blending amount of a filler, excellent in handling property and becoming a liquid state sealing material capable of invading for filling into a gap of ten and several μm between a semiconductor element and substrate plate in a good efficiency on implementing a flip chip. SOLUTION: This powdery material mixture for blending with the resin comprising (A) a metal oxide powdery material and (B) ≥1 kind of a powdery material (hereinafter, called "another powdery material") selected from a plate state inorganic powdery material, a fibrous inorganic powdery material, an amorphous inorganic powdery material, wood powder, a crushed powdery material of a thermosetting resin, resin particles obtained by a polymerization and an inorganic flame retardant is provided. The surface of either one of them or both of them may be treated with a basic substance or a basic mixture to make them as slightly basic. COPYRIGHT: (C)2005,JPO&NCIPI