RETAINER RING

PROBLEM TO BE SOLVED: To provide a retainer ring structured to hardly cause jump-out of a wafer even if using a polishing pad of high flexibility such as a suede-like polishing pad. SOLUTION: In this retainer ring 4, a retainer ring body 41 has a thick-walled part 411 and a thin-walled part 412, and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMATANI AKIHIKO, SHIMIZU TOSHIKUNI, TANAKA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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