RETAINER RING

PROBLEM TO BE SOLVED: To provide a retainer ring structured to hardly cause jump-out of a wafer even if using a polishing pad of high flexibility such as a suede-like polishing pad. SOLUTION: In this retainer ring 4, a retainer ring body 41 has a thick-walled part 411 and a thin-walled part 412, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMATANI AKIHIKO, SHIMIZU TOSHIKUNI, TANAKA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a retainer ring structured to hardly cause jump-out of a wafer even if using a polishing pad of high flexibility such as a suede-like polishing pad. SOLUTION: In this retainer ring 4, a retainer ring body 41 has a thick-walled part 411 and a thin-walled part 412, and pressure from a ring pressing body is applied to the thick-walled part 411. The thin-walled part 412 is provided with an inclined face 4121 going down toward the radially outside from the upper face of the thick-walled part 411. The pressure received by the thin-walled part 412 from the ring pressing body (not shown in the figure) is thereby weak compared to the thick-walled part 411, and slurry positively reaches the inside of the retainer ring 4 without being scraped out by the retainer ring 4. COPYRIGHT: (C)2005,JPO&NCIPI