THICK FILM CONDUCTOR COMPOSITION FOR USE AS MEMBRANE SWITCH

PROBLEM TO BE SOLVED: To provide a thick film conductor composition capable of increasing the life of MTS by reducing the conductor movement of a metal. SOLUTION: This thick film conductor composition includes (a) conductive silver powder, (b) a PVDF/HFP polymer resin, a copolymer of PVDF/HFP polyme...

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Bibliographische Detailangaben
1. Verfasser:	DORFMAN JAY R
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SWITCHES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE DEVICES INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL RELAYS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SELECTORS SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thick film conductor composition capable of increasing the life of MTS by reducing the conductor movement of a metal. SOLUTION: This thick film conductor composition includes (a) conductive silver powder, (b) a PVDF/HFP polymer resin, a copolymer of PVDF/HFP polymer resin, and a mixture thereof, and (c) an organic solvent, in which (b) is soluble to (c), and the PVDF/HFP resin has a melting viscosity of 0.2-0.7 kilo-poise, and a DSC melting temperature ranging from 85 to 98°C. COPYRIGHT: (C)2005,JPO&NCIPI