SEALING RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain a sealing resin composition which has excellent flame retardancy without substantially using a halogen-based flame retardant and an antimony compound, and has a low contracting property and a low moisture-absorbing property. SOLUTION: The sealing resin composition con...

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Bibliographische Detailangaben
1. Verfasser:	WADA YUZURU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a sealing resin composition which has excellent flame retardancy without substantially using a halogen-based flame retardant and an antimony compound, and has a low contracting property and a low moisture-absorbing property. SOLUTION: The sealing resin composition containing (a) an epoxy resin, (b) a phenolic resin curing agent, (c) a curing accelerator, (d) an inorganic filler, and (e) a coupling agent as essential components is characterized in that (a) the epoxy resin contains an epoxy resin represented by the formula (1) [(n) is an integer of ≥1] and an epoxy resin represented by formula (2) [(m) and (n) are each an integer of ≥1; R is an alkyl] and having a number-average mol. wt. of ≥1,500 as essential components and that (b) the phenolic resin curing agent contains a phenolic resin curing agent represented by formula (3) [(n) is an integer of ≥1] as an essential component. COPYRIGHT: (C)2005,JPO&NCIPI