NOZZLE FOR LOCAL SOLDERING, AND SOLDERING APPARATUS AND METHOD

PROBLEM TO BE SOLVED: To provide a nozzle for local solderings which prevents the occurrence of any solder bridge. SOLUTION: The nozzle for local solderings has its main body 3 provided in a main body 2 of a fused-solder vessel 1, a pump provided in the inside of the fused-solder vessel 1 and for fe...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HATAKEYAMA TOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!