NOZZLE FOR LOCAL SOLDERING, AND SOLDERING APPARATUS AND METHOD

PROBLEM TO BE SOLVED: To provide a nozzle for local solderings which prevents the occurrence of any solder bridge. SOLUTION: The nozzle for local solderings has its main body 3 provided in a main body 2 of a fused-solder vessel 1, a pump provided in the inside of the fused-solder vessel 1 and for fe...

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Bibliographische Detailangaben
1. Verfasser:	HATAKEYAMA TOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a nozzle for local solderings which prevents the occurrence of any solder bridge. SOLUTION: The nozzle for local solderings has its main body 3 provided in a main body 2 of a fused-solder vessel 1, a pump provided in the inside of the fused-solder vessel 1 and for feeding a fused solder to the inside of its main body 3, main bodies 5 of a plurality of cylinder apparatuses 4 attached to its main body 3 which are made of a heat resistant material, each piston 6 attached movably to each main body 5 and made of a heat resistant material, each rod 7 attached to each piston 6, wires 8 attached to the respective rods 7 which are made of copper plated by using chrome, and each electromagnetic valve 9 so provided between the fused-solder vessel 1 and each cylinder apparatus 4 as to connect the upper portion of the fused-solder vessel 1 with the lower portion of each main body 5. COPYRIGHT: (C)2005,JPO&NCIPI