SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device which has bumps formed on a lead wire, formed on a tape resin substrate with its chip for the semiconductor opposedly bonded, capable of improving an adhesion performance of a mask for plating for forming bumps after the lead wire formation to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANEKO HIDEYUKI, TETANI MICHINARI, KOYA NOBUYUKI, FURUYA KEISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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