SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device which has bumps formed on a lead wire, formed on a tape resin substrate with its chip for the semiconductor opposedly bonded, capable of improving an adhesion performance of a mask for plating for forming bumps after the lead wire formation to the resin tape base material and the lead wire, and to provide its manufacturing method. SOLUTION: A thick liquid material 34 as a means for eliminating a gap generated when the resist (mask) 31 is formed with a step between the resin-tape base material 33 and the lead wire 32 on the base material existed to improve the adhesion performance is filled in the gap between the resist 31 and the resin-tape base material 31. As the other method, there may be a pressure reduce or the like, by vacuuming between the lead wire and the resin tape base material after the mask forming. COPYRIGHT: (C)2005,JPO&NCIPI