EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide an epoxy resin composition providing a cured product having high flexibility, capable of forming a thin film, and having excellent heat resistance and adhesiveness. SOLUTION: A novolak-type resin of phenols, having 130-200°C softening point is used as a curing agent...

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Bibliographische Detailangaben
Hauptverfasser:	MOGI SHIGERU, AKATSUKA YASUMASA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition providing a cured product having high flexibility, capable of forming a thin film, and having excellent heat resistance and adhesiveness. SOLUTION: A novolak-type resin of phenols, having 130-200°C softening point is used as a curing agent in a bromine-containing bisphenol A-type epoxy resin having ≥350 g/eq epoxy equivalent. COPYRIGHT: (C)2005,JPO&NCIPI