OPTICAL SEMICONDUCTOR EQUIPMENT

OPTICAL SEMICONDUCTOR EQUIPMENT

PROBLEM TO BE SOLVED: To surely prevent malfunctions due to the light of an IC chip and electromagnetic noise, using a small number of parts by a comparatively simple structure. SOLUTION: This optical semiconductor equipment of light-receiving/emitting integrated type uses a lead frame 11. A shieldi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OKA JUNJI, ICHINOSE TOSHIYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To surely prevent malfunctions due to the light of an IC chip and electromagnetic noise, using a small number of parts by a comparatively simple structure. SOLUTION: This optical semiconductor equipment of light-receiving/emitting integrated type uses a lead frame 11. A shielding case part 111 is arranged between a light-receiving lens part 18 and a light-emitting lens part 19 of a resin package 17 formed by a translucent resin mold, by bending and forming a part of the lead frame 11 which is extended to the outside. COPYRIGHT: (C)2005,JPO&NCIPI