SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device where the bump of a semiconductor element can precisely be mounted on the electrode of a wiring board by paying attention to the joint of the semiconductor element and the wiring board in flip-chip joining. SOLUTION: A recognition mark 4 is pro...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKEOKA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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