SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device where the bump of a semiconductor element can precisely be mounted on the electrode of a wiring board by paying attention to the joint of the semiconductor element and the wiring board in flip-chip joining. SOLUTION: A recognition mark 4 is provided on the wiring board 1, and a mark 7 having a dummy bump 11 is provided at the position of the semiconductor 5 corresponding to the recognition mark 4. In order that the dummy bump 11 may be connected to the correct position of the corresponding recognition mark 4 on the wiring board 1, the semiconductor element 5 is mounted on the wiring board 1. Thus, even when the bump 10 is deviated with respect to the electrode 2 on the semiconductor element 5, flip chip bonding to the wiring board 1 can be precise, and the bump 10 of the semiconductor element 5 can be precisely joined to the electrode 2 of the wiring board 1. COPYRIGHT: (C)2005,JPO&NCIPI