TOOL FOR PLATING ELECTRONIC PART, AND ELECTROPLATING DEVICE

PROBLEM TO BE SOLVED: To provide a tool for plating electronic parts capable of relaxing the control of each length of leads and earth leads forming electronic parts, and capable of forming a plating film on each tip face of the leads and earth leads, and to provide an electroplating device. SOLUTIO...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOKI TOSHIYUKI, HAYASHI EISHIN, JINTSUGAWA IZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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