TOOL FOR PLATING ELECTRONIC PART, AND ELECTROPLATING DEVICE

PROBLEM TO BE SOLVED: To provide a tool for plating electronic parts capable of relaxing the control of each length of leads and earth leads forming electronic parts, and capable of forming a plating film on each tip face of the leads and earth leads, and to provide an electroplating device. SOLUTIO...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AOKI TOSHIYUKI, HAYASHI EISHIN, JINTSUGAWA IZUMI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a tool for plating electronic parts capable of relaxing the control of each length of leads and earth leads forming electronic parts, and capable of forming a plating film on each tip face of the leads and earth leads, and to provide an electroplating device. SOLUTION: The tool for plating electronic parts positions a plurality of electronic parts each composed of a base where leads inserted into through holes formed at the flat part of a metallic member are sealed with an insulating material and earth leads 18 whose one end part is joined thereto, and applies electroplating to the whole face of the exposed face in each member. The plating tool is provided with: a power supply member 34 arranged on one side of a pedestal 32 where a plurality of magnets 30 are disposed so as to be sealed at prescribed intervals in such a manner that each tip of the leads and earth leads is attracted; spherical bodies 36 of a magnetic substance connected to the power supply member and in which part of each tip of the leads and earth leads attracted by each magnet is simultaneously abutted on the spherical face; and a guide board 42 at which guide holes 44 are formed for guiding each tip of the leads and earth leads to the corresponding spherical body. COPYRIGHT: (C)2005,JPO&NCIPI