STRUCTURE FOR ADHESIVE-BONDING, ITS BONDING METHOD AND ADHEREND USED FOR IT

PROBLEM TO BE SOLVED: To provide a technique which effectively prevents an adhesive from being squeezed out, even when the adhesive is used in a large amount. SOLUTION: A depression 3 is formed on the bonding surface 2 of the adherend 1. The depression 3 receives an adhesive B spreading along the bo...

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Bibliographische Detailangaben
Hauptverfasser:	KAWASE TOYOO, SHIZAWA YOSHIO, DAITOKU TETSUO, TAKAHASHI HAJIME, OHORI KATSUYA, HARADA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technique which effectively prevents an adhesive from being squeezed out, even when the adhesive is used in a large amount. SOLUTION: A depression 3 is formed on the bonding surface 2 of the adherend 1. The depression 3 receives an adhesive B spreading along the bonding surface on bonding and confines the spread of the adhesive B. A protrusion 4 is formed around the depression 3. The protrusion 4 dams up the squeezed-out adhesive B. COPYRIGHT: (C)2005,JPO&NCIPI