ELECTRONIC COMPONENT PACKAGING METHOD, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an electronic component packaging method that allows achieving reduction in the package area and a thinner semiconductor device, a semiconductor module, and a semiconductor device. SOLUTION: The electronic component packaging method is for bonding an electrode formed on a substrate and an electrode formed on an electronic component, wherein the bonding is performed by a metal layer, in which at least one kind of metal particle is flocculated. The metal particles have a particle diameter, ranging from 1 to 50 nm. Preferably, the metal layer preferably has a thickness, ranging from 5 to 100 μm. COPYRIGHT: (C)2005,JPO&NCIPI