DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To solve the problem that operation efficiency of a device is deteriorated since an operator periodically stops the device and manually moves a grinding wheel 4A and a polishing file, for preventing an end on the tip face of a thermo-compression bonding chip 1A from being irreg...
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| creator | SASAKI KOUKI KASAHARA KAZUO |
| description | PROBLEM TO BE SOLVED: To solve the problem that operation efficiency of a device is deteriorated since an operator periodically stops the device and manually moves a grinding wheel 4A and a polishing file, for preventing an end on the tip face of a thermo-compression bonding chip 1A from being irregularly cut at a step and from adversely affecting a thermo-compression bonding processing, since a use part is cut and an irregular step is formed with a part which is not used in the grinding stone 4A and the polishing file, in a manufacturing device and a manufacturing method of an electronic component, with which an outer electrode of the electronic component, a terminal of a winding or a terminal of a lead line are thermo-compression-bonded by the thermo-compression bonding chip and the file. SOLUTION: A polishing mechanism 13 has a driving roller 13F and a winding roller 13C for moving sandpaper 13A while a thermo-compression bonding head 12 is operated and changing a polishing position as moving mechanisms. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
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SOLUTION: A polishing mechanism 13 has a driving roller 13F and a winding roller 13C for moving sandpaper 13A while a thermo-compression bonding head 12 is operated and changing a polishing position as moving mechanisms. 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SOLUTION: A polishing mechanism 13 has a driving roller 13F and a winding roller 13C for moving sandpaper 13A while a thermo-compression bonding head 12 is operated and changing a polishing position as moving mechanisms. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MACHINE TOOLS MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SOLDERING OR UNSOLDERING TRANSFORMERS TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT |
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