DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To solve the problem that operation efficiency of a device is deteriorated since an operator periodically stops the device and manually moves a grinding wheel 4A and a polishing file, for preventing an end on the tip face of a thermo-compression bonding chip 1A from being irregularly cut at a step and from adversely affecting a thermo-compression bonding processing, since a use part is cut and an irregular step is formed with a part which is not used in the grinding stone 4A and the polishing file, in a manufacturing device and a manufacturing method of an electronic component, with which an outer electrode of the electronic component, a terminal of a winding or a terminal of a lead line are thermo-compression-bonded by the thermo-compression bonding chip and the file. SOLUTION: A polishing mechanism 13 has a driving roller 13F and a winding roller 13C for moving sandpaper 13A while a thermo-compression bonding head 12 is operated and changing a polishing position as moving mechanisms. COPYRIGHT: (C)2005,JPO&NCIPI