DEPOSITION-PREVENTIVE PLATE FOR VACUUM THIN FILM DEPOSITION APPARATUS

PROBLEM TO BE SOLVED: To provide a deposition-preventive plate from which depositions do not drop under thin film deposition, and whose deformation and fusion caused by heat can be prevented. SOLUTION: In the deposition-preventive plate for a vacuum thin film deposition apparatus, a material having...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI MASANORI, NAGASAWA TAKESHI, IZEKI SEIJI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a deposition-preventive plate from which depositions do not drop under thin film deposition, and whose deformation and fusion caused by heat can be prevented. SOLUTION: In the deposition-preventive plate for a vacuum thin film deposition apparatus, a material having a thermal expansion coefficient of ≤10-5/K and a heat resistant temperature of ≥1,000°C is used. COPYRIGHT: (C)2005,JPO&NCIPI