ELECTRONIC PART MOUNTING DEVICE AND METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide an electronic part mounting device having a compact structure, and to provide an electronic part mounting method displaying excellent working efficiency. SOLUTION: The electronic part mounting device carries out a part mounting process in a manner that a chip 6 is ta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: EMOTO YASUHIRO, YAKEYAMA HIDEYUKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic part mounting device having a compact structure, and to provide an electronic part mounting method displaying excellent working efficiency. SOLUTION: The electronic part mounting device carries out a part mounting process in a manner that a chip 6 is taken out from a wafer ring 5 held by an electronic part supply unit 2 with a mounting head 33, and mounted on a board 16 held by a board holding unit 10. A jig replacing mechanism 49 supplies the wafer rings 5 with chips to the electronic part supply unit 2, and unloads the empty wafer rings 5 from the electronic part supply unit 2 to replace them with those housing chips held by the wafer supply unit 17. The jig is mounted on a second beam member 32 mounted with a second camera 35 serving as a part imaging camera, so that the jig replacing mechanism 49 and the second camera 35 can be integrally moved. By this setup, the electronic part mounting device can be made more compact than a case that a discrete jig replacement mechanism is provided, and an electronic part mounting method can be provided which is improved in working efficiency by eliminating a time lag necessary for preventing part recognition action and jig replacement action from interfering with each other. COPYRIGHT: (C)2005,JPO&NCIPI