GRINDING CARRIER

PROBLEM TO BE SOLVED: To provide a grinding carrier by which sophisticated setting specifications adaptable to grinding of a thin member to be ground with a large area can be easily realized and workability and economical efficiency of the grinding can be improved. SOLUTION: The grinding carrier has...

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Bibliographische Detailangaben
Hauptverfasser:	TOMURO YASUSHI, MORISANE TOSHITOMO, TAKAHASHI KUNITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a grinding carrier by which sophisticated setting specifications adaptable to grinding of a thin member to be ground with a large area can be easily realized and workability and economical efficiency of the grinding can be improved. SOLUTION: The grinding carrier has the following constitution. A metallic oxide glass film 22 is formed on the surface of a paper base material 21. A titanium nitride film 23 including boron, which is a first metallic sputtered film, is formed on the metallic oxide glass film 22. A nickel film 24 being an electroless plating film is formed on the titanium nitride film 23. A titanium oxide film 25 being a second metallic sputtered film is formed on the nickel film 24. COPYRIGHT: (C)2005,JPO&NCIPI