SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To relieve stresses applied to external terminals of a semiconductor device. SOLUTION: The semiconductor device comprises a semiconductor chip 10, a wiring board 20 mounted with the chip 10, and a plurality of external terminals 40 provided on the wiring board 20. The plurality...

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Bibliographische Detailangaben

1. Verfasser:	AOYANAGI TETSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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