SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To relieve stresses applied to external terminals of a semiconductor device. SOLUTION: The semiconductor device comprises a semiconductor chip 10, a wiring board 20 mounted with the chip 10, and a plurality of external terminals 40 provided on the wiring board 20. The plurality of external terminals 40 include at least one first external terminal 42 and two or more second external terminals 44, 45, 46 and 47. The first external terminal 42 is composed of a brazing material, and each second external terminal 44, 45, 46 and 47 includes a brazing material and a plurality of particles dispersed in the brazing material and composed of. Of the external terminals 40, paired external terminals disposed further separately from each other than the other paired external terminals become the second external terminals 44, 45, 46 and 47. COPYRIGHT: (C)2005,JPO&NCIPI