PROTECTIVE SHEET FOR WORKING SEMICONDUCTOR WAFER, AND METHOD FOR GRINDING REAR OF THE SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide a protective sheet for working a semiconductor wafer capable of inhibiting warpage of the semiconductor wafer at a small value, even when the large-sized wafer is thinned by a back-grinding process, a rear-surface treating process or the like. SOLUTION: In the protective sheet for working the semiconductor wafer used for protecting the surface of the semiconductor wafer formed in a pattern, when the rear of the wafer is ground, a pressure-sensitive adhesive layer is laminated on at least one surface on a base material, and the base material is composed of one layer or multilayers. In the protective sheet, at least one layer of the base material has a tensile modulus of elasticity of 0.6 GPa or higher at 23°C, and the outermost layer of the base material on the side reverse to the pressure-sensitive adhesive layer brought into contact with the surface of the semiconductor wafer has a coefficient of a water absorption of 0.3% or lower. COPYRIGHT: (C)2005,JPO&NCIPI