COPPER ALLOY WIRE MATERIAL FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a copper alloy wire material for electronic components reconciling strength and conductivity with good balance as a connector. SOLUTION: A covering layer made of copper-zinc alloy is formed on an outer periphery of a core material made of copper or a copper alloy, an...

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Bibliographische Detailangaben
Hauptverfasser:	KIMOTO KUNIAKI, SAWAHATA KATSUNORI, KATO HIROYUKI, KURODA HIROMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS APPARATUS THEREFOR AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS INSULATORS LINE CONNECTORS MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PUNCHING METAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a copper alloy wire material for electronic components reconciling strength and conductivity with good balance as a connector. SOLUTION: A covering layer made of copper-zinc alloy is formed on an outer periphery of a core material made of copper or a copper alloy, and a ratio (B/A) of a cross section area (B) of the wire material against a cross section area (A) of the wire material is to be 0.15 to 0.6. COPYRIGHT: (C)2005,JPO&NCIPI