METHOD OF MANUFACTURING STACKED ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a stacked electronic component by which the thicknesses of external electrodes formed on the sides of a laminate can be reduced (and uniformized) and the electrodes can be compacted and, at the same time, the dimensional accuracy of the external electrodes to the laminate can be improved. SOLUTION: The method of manufacturing a stacked electronic component includes a step of forming electroless-plated layers on the laminate by adhering a plating liquid to the forming areas of the external electrodes by bringing the sides of the laminate on which elemental body layers and internal electrodes layers are exposed into contact with an impregnated member after the member is impregnated with at least the plating liquid. Alternatively, the method includes a step of forming electroless-plated layers only in the forming areas of the external electrodes by performing masking on the laminate so that only the forming areas of the external electrodes of the laminate, on which the elemental body layers and internal electrode layers are exposed, may be exposed, and bringing the masked laminate into contact with the plating liquid. COPYRIGHT: (C)2005,JPO&NCIPI