STACKED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide a stacked electronic component in which the thicknesses of internal electrode layers can be reduced and, at the same time, the occurrence of delamination, cracking, discontinuity of internal electrodes, or the like, caused by the difference in contraction between dielectric layers and the internal electrode layers can be prevented without adding any new facility nor process, and to provide a method of manufacturing a stacked electronic component. SOLUTION: The stacked electronic component is composed of a laminate of layers composed of elemental bodies and the internal electrode bodies. In the method of manufacturing the electronic component, the masks corresponding to the patterns of internal electrodes are first formed on the surfaces of conductive supporting bodies. Then the internal electrode layers containing a common material constituting the elemental bodies are formed on the surfaces of the supporting bodies exposed from openings by electroplating, by putting the supporting bodies in a plating liquid containing the common material. Thereafter, the laminate is formed by repeatedly transferring the internal electrode layers from the supporting bodies to the surfaces of the elemental bodies by press-fitting the supporting bodies to the elemental bodies. COPYRIGHT: (C)2005,JPO&NCIPI