SEMICONDUCTOR CHIP AND LIQUID CRYSTAL DISPLAY WITH SEMICONDUCTOR CHIP MOUNTED THEREON

SEMICONDUCTOR CHIP AND LIQUID CRYSTAL DISPLAY WITH SEMICONDUCTOR CHIP MOUNTED THEREON

PROBLEM TO BE SOLVED: To provide a semiconductor chip which can be reduced in size and increased in the degree of integration by improving connection reliability in connection using an anisotropic conductive adhesive. SOLUTION: The semiconductor chip 1 has a plurality of bumps 3 which are electrical...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MAEDA IKUHISA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor chip which can be reduced in size and increased in the degree of integration by improving connection reliability in connection using an anisotropic conductive adhesive. SOLUTION: The semiconductor chip 1 has a plurality of bumps 3 which are electrically connected to electrodes 12 of another member 11 using the anisotropic conductive adhesive 21. Between adjacent bumps 3A and 3B, an insulator 4A which is higher than these bumps is formed. COPYRIGHT: (C)2005,JPO&NCIPI