ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide an adhesive composition giving stable adhesion with more improved acid resistance than those of conventional adhesives. SOLUTION: The adhesive composition uses a main agent of a bisphenol F type epoxy resin and a modified polyamide amine as a curing agent. COPYRIGHT:...

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Bibliographische Detailangaben
1. Verfasser:	YAMASHITA TAKAMI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive composition giving stable adhesion with more improved acid resistance than those of conventional adhesives. SOLUTION: The adhesive composition uses a main agent of a bisphenol F type epoxy resin and a modified polyamide amine as a curing agent. COPYRIGHT: (C)2005,JPO&NCIPI