MICROELECTRONIC BONDING WITH LEAD MOTION

PROBLEM TO BE SOLVED: To accurately connect a portion of a microelectronic assembly having multiple contacts to a connection component including multiple leads each of which is equipped with a long narrow connector having at least one projection extending outward. SOLUTION: There are provided a proc...

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Bibliographische Detailangaben
Hauptverfasser:	KOVAC ZLATA, DISTEFANO THOMAS H, GRANGE JOHN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To accurately connect a portion of a microelectronic assembly having multiple contacts to a connection component including multiple leads each of which is equipped with a long narrow connector having at least one projection extending outward. SOLUTION: There are provided a process of juxtaposing a connection component 20 to a portion of a semiconductor chip assembly 10 so that respective leads are adjacent to their corresponding contacts; and a process of engaging a connector 32 on a tool so that the connector is engaged on at least one projection of the tool for restricting the motion of the tool in the longitudinal direction relative to the connector, and of displacing a bonding region 29 of the connector 32 so that the bonding region is engaged on a contact 18 for connecting the bonding region of the connector to its corresponding contact 18. COPYRIGHT: (C)2005,JPO&NCIPI