SEALING PACKAGE

SEALING PACKAGE

PROBLEM TO BE SOLVED: To provide an inexpensive sealing package with a low height that is easily manufactured. SOLUTION: The sealing package is made of ceramic and covar and a ceramic substrate has through-holes for penetrating terminals for electric conduction to elements in the package. The two th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KANEKIYO TOMOYUKI, MAKIO SATOSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an inexpensive sealing package with a low height that is easily manufactured. SOLUTION: The sealing package is made of ceramic and covar and a ceramic substrate has through-holes for penetrating terminals for electric conduction to elements in the package. The two through-holes or over are provided, and metalized plating film is applied to their inner wall parts and to the ceramic substrate with a diameter greater than the outer diameter of the through-holes. The metalized plating films are desirably non-conductive to each other. COPYRIGHT: (C)2005,JPO&NCIPI