SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of ensuring the reliability of the connection between a semiconductor element and a resin substrate even when heat is repeatedly applied to the device over a long period of time owing to the operation of the semiconductor element and to...
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Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device capable of ensuring the reliability of the connection between a semiconductor element and a resin substrate even when heat is repeatedly applied to the device over a long period of time owing to the operation of the semiconductor element and to a change in use environment temperature. SOLUTION: The semiconductor device comprises a resin substrate 1 having a mounting part for mounting a semiconductor element 4 at an upper surface central part, the semiconductor element 4 flip-chip connected to and mounted on the mounting part via a solder bump 8, a resin loading agent 9 loaded between the semiconductor element 4 and the resin substrate 1, a metal frame 2 joined to the upper surface outer peripheral part of the resin substrate 1 so as to surround the semiconductor element 4, and a metal cover 3 joined to the upper surface of the metal frame 2 so as to surround the semiconductor element 4. The glass transition point of the resin loading material 9 falls within a range of from 50 to 90°C. COPYRIGHT: (C)2005,JPO&NCIPI |
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