SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, CIRCUIT BOARD, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, a method for manufacturing the same, a circuit board, and an electronic apparatus. SOLUTION: A protective film 20 having an aperture is formed on a circuit board including a wiring pattern 12 to make the surface uneven and to e...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	AOYANAGI TETSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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