SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, CIRCUIT BOARD, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, a method for manufacturing the same, a circuit board, and an electronic apparatus. SOLUTION: A protective film 20 having an aperture is formed on a circuit board including a wiring pattern 12 to make the surface uneven and to expose a part of the wiring pattern 12 from the aperture. A semiconductor chip 30 including an electrode 32 is mounted to the circuit board, and a part 14 exposed from the aperture in the wiring pattern 12 is provided opposing to the electrode 32 to make electrical connection. The protective film 20 is formed in the manner that the concave part of the uneven surface is not provided through the protective film 20. COPYRIGHT: (C)2005,JPO&NCIPI