SUSPENSION SUBSTRATE WITH CIRCUIT AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a manufacturing method for a suspension substrate with a circuit by which a terminal part can be formed by electroplating without exposing a conductor layer to the outside and the number of processes can be reduced, and a suspension substrate with the circuit manufactured by the manufacturing method. SOLUTION: After a base insulation layer 3 in which a second opening part 12 is formed is formed on a supporting substrate 2 with the prescribed pattern, a metallic thin film 13 is formed on the whole surface of the base insulation layer 3 and the surface of the supporting substrate 2 including the second opening part 12 exposed from the base insulation layer 3, and the conductor layer 4 is formed on the metallic thin film 13 as a wiring circuit pattern. Then, a cover insulation layer 10 is formed so that a pad opening part 11 is opened, and a pad part 16 is formed at the pad opening part 11 by utilizing the supporting substrate 2 as the lead part of electroplating. Then, a first opening part 25 is formed at an opposite part to the second opening part 12 in the supporting substrate 2 as a larger opening than the second opening part 12. COPYRIGHT: (C)2005,JPO&NCIPI