METHOD AND DEVICE FOR SUBSTRATE EXPOSURE, METHOD FOR MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a method and a device for substrate exposure in which gaps can easily be set to respective substrate parts allocated to a multiple-part exposed substrate which is exposed while a plurality of allocated substrates are allocated to the exposed substrate and the through...

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Bibliographische Detailangaben
Hauptverfasser:	MINEGISHI MANABU, OTSUKA TOMOO, KOZUKA TOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FREQUENCY-CHANGING HOLOGRAPHY MATERIALS THEREFOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and a device for substrate exposure in which gaps can easily be set to respective substrate parts allocated to a multiple-part exposed substrate which is exposed while a plurality of allocated substrates are allocated to the exposed substrate and the throughput of exposure processing can be improved. SOLUTION: For 2nd and succeeding exposed substrates, only one allocated substrate of a large-sized exposed substrate is performed and the remaining allocated substrates are only positioned for gap setting corresponding to units and the height position of a tilt mechanism to start exposure processing. Consequently, parallelizing processing can be omitted, so the positioning of gap setting for respective allocated substrates can be performed in a short period of time to improve the throughput of the exposure processing. COPYRIGHT: (C)2005,JPO&NCIPI