SUBSTRATE TREATING DEVICE

PROBLEM TO BE SOLVED: To provide a substrate treating device that can reduce the difference between the processed results of treating units when a plurality of same type of treating units are operated in parallel with each other. SOLUTION: When the plurality of same type of treating units is operate...

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Bibliographische Detailangaben
Hauptverfasser:	HAJIKI KENJI, KOYAMA YASUFUMI, NAGAKAMI YUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate treating device that can reduce the difference between the processed results of treating units when a plurality of same type of treating units are operated in parallel with each other. SOLUTION: When the plurality of same type of treating units is operated in parallel with each other, libraries containing the values of parameters (treatment parameters) regarding treating conditions are registered at every unit. When, for example, three coating units 8a-8c are operated in parallel with each other, the libraries 101-103 corresponding to the units 8a-8c are provided and registered at every unit. Since the libraries 101-103 contain the values of parameters regarding numbers of revolutions, and so on, treatment parameters are set at every unit. Consequently, the performance differences among the treating units which are operated in parallel with each other can be absorbed by adjusting the treating conditions among the treating units. COPYRIGHT: (C)2005,JPO&NCIPI