COMPOSITION CONTAINING CARBOXYLIC PHOTOSENSITIVE RESIN

PROBLEM TO BE SOLVED: To provide a curable composition giving an excellent cured film which satisfies such properties as electric insulation, PCT (pressure cooker test) resistance, adhesion, solder heat resistance, chemical resistance and resistance to electroless gold plating in addition to crackin...

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Bibliographische Detailangaben
1. Verfasser:	KOBIYAMA NOBORU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curable composition giving an excellent cured film which satisfies such properties as electric insulation, PCT (pressure cooker test) resistance, adhesion, solder heat resistance, chemical resistance and resistance to electroless gold plating in addition to cracking resistance. SOLUTION: The curable composition comprises (A) a carboxylic photosensitive resin obtained by reacting a compound (a) having two or more phenolic hydroxyl groups in one molecule with an alkylene oxide (b) or cyclic carbonates (c), reacting the resulting reaction product (d) with an unsaturated-group-containing monocarboxylic acid (e) and a saturated aliphatic monocarboxylic acid (f) and/or an aromatic monocarboxylic acid (g), and reacting the resulting reaction product (h) with a polybasic acid anhydride (i), (B) a photopolymerization initiator, (C) a photosensitive (meth)acrylate compound and (D) a diluting solvent. COPYRIGHT: (C)2005,JPO&NCIPI